Ceramic Semiconductor Packages

For 30 years our proven track record consistent customer service and long standing supplier relationships makes us the premier distributor for your ic packaging needs.

Ceramic semiconductor packages.

Is a world wide authorized distributor of packages and lids for ic assembly. Kyocera will exhibit its ceramic packages for mems and sensors at apcot 2016. Spectrum semiconductor materials extensive inventory of ceramic cerpac packages are available in 14 18 20 24 and 28 pin configurations. Located in silicon valley spectrum semiconductor materials inc.

Hermetic packages national semiconductor offers a wide variety of ceramic and metal can packages for through hole and surface mount ap plications. Three engineers from fairchild. Cerpac packages sold in three separate components cerpac base cerpac frame and cerpac cap. Kyocera will present its ceramic packages at elexcon 2016 china s most popular electronics exhibition.

These packages protect the crystal with full hermetic sealing for high reliability while measuring just 1 0 x 0 8 mm among the world s smallest. These ceramic and metal can packages are of. The first semiconductor package. The pressed ceramic packages are typically lower in cost than the multilayer packages.

Micro ball grid array μbga. Kyocera will present its ceramic packages at cioe 2018 china s most popular optoelectronics exhibition. Ametek offers both glass to metal seal and ceramic to metal seal technology to its customers. A package with metric pin distribution 0 5 mm pitch.

Don forbes rex rice and bryant rogers invented a 14 lead ceramic dual in line package dip with two rows of pins. Dip packages came into volume production in early 70 s. However the simple construc. A semiconductor package is a metal plastic glass or ceramic casing containing one or more discrete semiconductor devices or integrated circuits individual components are fabricated on semiconductor wafers commonly silicon before being diced into die tested and packaged the package provides a means for connecting it to the external environment such as printed circuit board via leads.

The body of the component is ceramic. Ceramic column grid array ccga. Ball spacing less than 1 mm. This was the first real semiconductor package.

Ultra small ceramic packages help miniaturize highly functional crystal devices which are essential in electronics. Depending on the application weight thermal solution and material requirements ametek can help you design a package using one of these technologies to best meet your requirements.